Speaker
Description
The development of hybrid pixel detectors requires a reliable and cost-effective interconnect technology, especially one that enables the hybridisation of single dies, offering greater flexibility for R&D and low-volume production. This presentation highlights the current status and recent advancements of in-house hybridisation processes developed within the CERN EP R&D programme and the AIDAinnova collaboration. These include bonding with Anisotropic Conductive Adhesives (ACA) as well as gold-stud bonding with epoxy underfill. The ACA approach replaces conventional solder bumps with conductive micro-particles embedded in an epoxy layer, applied either as a film or a paste, and enables electro-mechanical connection via thermo-compression using a flip-chip bonder.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |