Speaker
Description
This project aims at developing the next generation of 3D pixel sensors, further progressing in the
trend of decreasing pixel size which started with the ATLAS IBL and continued with the ATLAS ITk
and CMS Inner Tracker 3D pixels. Target applications are the possible Phase-3 upgrades of ATLAS
and CMS and the upgrade of LHCb VELO (with timing). Inherent to the 3D pixel architecture is the
improvement in the radiation hardness as the interelectrode distance is decreased, which promises to
mantain the devices fully efficient up to irradiation fluences of 10 17 n eq cm -2 and beyond. Novel pixel
layouts with multiple column configurations are also expected to offer excellent time resolution,
comparable to the 3D-trench devices. Two production runs are foreseen at FBK with an optimized
single-sided technology allowing for a good fabrication yield also in case of large size pixel arrays.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | II. Presentation on project proposal |
