Speaker
Description
Sensors with fast timing capabilities are a critical component for all future tracking detectors to disentangle high multiplicity events. Silicon 3D sensors utilize columns etched orthogonal to the sensor substrate as their readout electrodes, in contrast to regular, planar, detector technologies, where the electrodes are only found on the sensor surface. 3D sensors display, in addition to their excellent time resolution, a high radiation tolerance, making them ideal candidates for use in HEP tracking detectors.
In the course of a common RD50 project, 3D sensors with two different column layouts, hexagonal and rectangular, and different column counts were designed and produced by CNM.
In this talk the IV and CV characteristics of these 3D sensors and initial fast timing measurement results for a small number of samples will be presented. Furthermore, a quick overview of the new amplifier boards designed in Freiburg will be given.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |
