Speaker
Description
This Common Project proposal aims to develop a HV-CMOS multi-chip pixel detector demonstrator suitable for large scale production in future Higgs factory experiments, based on multi-chip modules with data aggregation and serial powering capabilities. These multi-chip modules, including low-mass multilayer flexible PCBs, will then be integrated in staves, where modules will be powered in serial mode utilising the on-chip Shunt Low Drop Out (SDLO) regulators. Together with data aggregation, this will substantially reduce the number of stave data and power connections. Low-mass aluminium flex productions, innovative connection methods (e.g. single-point Tape Automated Bonding), low-mass mechanical support, and efficient cooling technologies will be explored for overall system optimization in power and material budget. The expertise gained by the participating institutes will be beneficial for the integration of future large scale devices that will be developed by the strategic DRD3 projects in the next few years.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | II. Presentation on project proposal |
