As part of the CERN EP R&D programme and the AIDAinnova collaboration, innovative and scalable concepts for hybridisation and module integration are being developed for pixel detector applications in future colliders. Most interconnect processes require specific surface properties and topologies of the bonding pads. An in-house Electroless Nickel Gold (ENIG) plating process is therefore under...
The development of hybrid pixel detectors requires a reliable and cost-effective interconnect technology, especially one that enables the hybridisation of single dies, offering greater flexibility for R&D and low-volume production. This presentation highlights the current status and recent advancements of in-house hybridisation processes developed within the CERN EP R&D programme and the...
To reduce the material budget and maximize the active area of sensors for future experiments, a 30 µm thick lightweight flex has been developed. The fabrication technology, combined with novel interconnection techniques, enables compact packaging through the direct attachment of chip connection pads to the flex. In addition to interconnection methods such as Anisotropic Conductive Films and...
This work presents a novel approach for the packaging of ALPIDE/ALTAI chips that unlocks compact and non-planar assemblies with a minimal material budget. This solution represents an advancement based on methodologies developed for the ALICE ITS1 and the STAR tracker two decades ago. The core of this approach involves the use of flexible cables composed of aluminum and polyimide, with...
Wafer to wafer bonding offers an economic approach to interconnect all readout electronic chips with the solid-state sensor chips on the wafer by only one bonding step. This is a promising technology for the fabrication of 3D integrated ultra-thin hybrid modules for particle detection and timing layers in future particle detectors. The technology described in this contribution combines the...
