Speaker
Description
The technology of amorphous silicon-based micro-channel plates (AMCPs) uses a versatile approach to stack hydrogenated amorphous silicon in thicknesses up to 100 μm, using plasma-enhanced chemical vapor deposition (PECVD) and etch microchannels of diameter below 2 μm every 5 μm, on a hexagonal pattern, by deep reactive ion etching. With gains up to 1000 for reverse bias less than 300 V, the design is possible to build on arrays of sensitive transimpedance amplifiers, integrated in read-out circuits with high channel density, such as for instance 15 by 15 μm. This ensures single photon detection with quantum efficiency up to 30% and noise rates below 50 Hz/cm², if combined with state of the art photocathodes such as the hi-QE from Photonis. Current fabrication runs focus on direct integration of the stack on ASICs, to be integrated with the photocathode over the next months. Measurements show timing response with jitter below 10 ps, making this high-precision photodetector ideal for radiation detectors combining ultra-fast photon emission and low light yield, such as Cherenkov.
| Track | FTMI |
|---|---|
| Presentation type | Oral |