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DRD3 October test beam discussion on AIDAInnova
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Europe/Zurich
DRD3 - WG5 Characterization Techniques, Facilities
Next steps
- Ivan to contact Marcos to clarify the wire bonding schedule for the 3D sensors. ITo keep Claudia in CC)
- Ivan to get formal confirmation for the additional two weeks of testing time in October.
- Claudia to organize RP transfer for the samples once boards are available.
- Claudia/Marcos to contact the bonding lab to arrange a meeting for wire bonding.
- Adriano to suggest which samples should be mounted on his boards for apple-to-apple comparison.
- Adriano to send mechanical drawings of the four-channel boards to Ivan for preparing support frames.
- Adriano to provide bonding information and documentation to Claudia.
- Adriano to check availability of PCBs with Calgary front-end electronics and send them to CERN.
- Marcos to organize another meeting (DRD3 scope) on Friday at 11 to confirm the testing schedule.
Summary
3D test beam preparation progress
Ivan reported progress on 3D sensors, including finding a supplier for second-stage amplifiers and completing the mechanics for testing frames. He mentioned that 10 UCSC boards would be shipped to CERN for wire bonding. Ivan also noted that Jordi would bring a CROC sensor for defining the region of interest during the first week of testing and the 2nd stage applifiers.
Ivan explained the DAQ setup would use an oscilloscope with 6 GHz bandwidth to measure time resolution, with commissioning planned for the first week of testing starting Wednesday.
3D Samples
Claudia reported dividing Adriano's samples into four fluence groups, with the highest fluence samples still being processed. They agreed to coordinate with Marcos regarding board availability and bonding lab scheduling.
Gian-Franco presented the layout and testing structure of a device with two rows. Layout includie a standard version with a continuous ohmic trench and a dashed version with interrupted trenches.
Anna inquired about using a single channel for the UCSC board, Gian-Franco explained should connect to the central pixel while keeping the first two neighbors grounded. Claudia requested a bonding diagram for clarity, which Adriano agreed to provide within a few days.
Ivan raised a concern about 3D sensor IV curves, which Gian-Franco clarified were measured on arrays but not all test structures, noting a high yield of over 90% for 32x32 arrays.
Timespot Front-end for 3Ds
Adriano proposed providing PCBs with Calgary electronics for testing alongside different electronics to compare performance and disentangle setup and frontend contributions.
Ivan requested mechanical drawings to prepare supports for the boards.
Claudia inquired about bonding information, documentation, and timeline for availability, with Adriano estimating potential delivery next week if samples are available.
TI-LGAD Sample Status
Iskra confirmed she had 14 irradiated wire-bonded and ready for testing, while Anna noted that Lena had brought two chubut boards and additional samples to CERN.
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