Speaker
Description
The increasing integration density of silicon pixel sensors, together with emerging applications such as module-level power conversion and enhanced on-detector signal processing, significantly raises the demand for advanced thermal management solutions. Efficient heat removal at the module level is becoming a critical requirement for ensuring stable and reliable operation. In this work, we demonstrate the use of nanowire-based interconnects to improve the thermal coupling between a silicon die and a heat sink, achieving superior performance compared to conventional thermal interface materials such as conductive pastes.
Two bonding approaches for nanowire integration, adhesive bonding and sintering, are presented and systematically compared in terms of thermal efficiency, bonding process requirements, and bonding process demands. The advantages and constraints of each method are discussed, highlighting their suitability for different integration scenarios. Furthermore, we demonstrate that these bonding technologies can be employed not only to enhance thermal conduction but also to mechanically mount silicon pixel sensors onto supporting structures. This dual functionality provides both improved heat dissipation and robust mechanical stability using minimal material.
Together, the presented thermal and mechanical bonding strategies offer a scalable pathway to enhance module-level thermal stability, supporting the performance and longevity of future high-density detector systems and related applications.