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BGI Regular Meeting

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865/1-B03 (CERN)

865/1-B03

CERN

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Present: Gunn, Hampus, James, Justus, Juri, Lukas, Mark, Ray, Steen, William, Wilfried

Introduction

This inaugural regular BGI meeting was established to provide a single coordination forum for all BI contributors working on BGI instruments across the HL-LHC, PS, and SPS, spanning hardware, software, mechanics, and operations. The agreed format is a bi-weekly meeting, split evenly between HL-LHC BGI and PS/SPS BGI topics, with agendas, minutes, and actions maintained on Indico. The objective is to improve coordination, visibility of ongoing work, and alignment on priorities, particularly during Q1 2026 where several key deliverables converge.

HL-LHC BGI

The main focus for Q1 2026 is to finalise the HL-LHC BGI instrument design intended for installation in LS3 (the term “prototype” was agreed to be misleading and should be dropped). The dominant open technical issue is the Timepix4 attachment concept, encompassing mechanical fixation, thermal dissipation (~10 W), UHV compatibility, and grounding. Three candidate solutions were discussed: (A) glue or Staystik to a metal base (baseline, drawing on PS/SPS experience), (B) TSV-based flip-chip mounting, and (C) wire-bonded chip brazed to a ceramic carrier. Ongoing and planned actions include UHV testing of candidate glues and Staystik, thermal simulations of all options, discussions with the Timepix group to learn from existing TSV-in-vacuum applications, and convergence on a mechanically and thermally robust solution. In parallel, participants highlighted the need for a clear project schedule, preparation of the LHC ECR, development of an engineering specification for alignment tolerances, and continued work on impedance matching, magnet integration, cabling, racks, machine protection interfaces, and infrastructure readiness.

PS & SPS BGI

For PS and SPS BGI, the priority remains implementation of DAQ version 5 and preparation for routine operation starting from April 2026. Hardware availability is no longer a limiting factor; progress is now software-driven and running approximately one week behind schedule, with contingency still available. It was agreed to improve communication with OP and ABP via regular (likely monthly) user meetings or updates. Recent hardware interventions include installation of new high-transparency RF shields in the SPS and identification of unexpected signals attributed to aluminium fluorescence. Operational improvements were discussed, including relocation of a ferrite previously disturbing the magnetic field, preparation of a spare SPS instrument, and confirmation that no major showstoppers are currently identified for PS/SPS operation.

Summary of Actions

HL-LHC BGI

  • Compile full list of open design points and track actions — James

  • Prepare LHC ECR outline — James

  • Define detailed project schedule and milestones — James

  • Coordinate UHV testing of candidate glues and Staystik — Lauren (ordering support: Mark)

  • Discuss TSV vacuum use and assembly processes with Timepix group — Mark

  • Develop impedance-matching solution for HV connector and associated thermal handling — Mark

  • Produce engineering specification outline  —  James.  

  • Produce alignment engineering specification (E-field vs B-field tolerances) — Gunn

  • Continue magnet integration and mechanical alignment work — William

  • Track infrastructure and machine protection items (cables, HV, machine protection interfaces) — Gunn

PS & SPS BGI

  • Set up regular PS/SPS BGI user / OP-ABP update meetings — Hampus

  • Finalise spare SPS instrument preparation — William

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