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09:15
SiPM Interconnections to 3D electronics
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Jelena Ninkovic
(Max PlanckInstitute for Physics)
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09:30
Perspective of the sensor interconnectivity to the TSV readout ASIC
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Juha Kalliopuska
(University of Helsinki Faculty of Science)
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09:45
development of HV CMOS - sensors for 3D integration
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Ivan Peric
(Ruprecht-Karls-Universitaet Heidelberg (DE))
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10:00
Vertical Integration techniques used for MEMS
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Lutz Hofmann
(Fraunhofer ENAS)
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10:15
IMEC's activities in imagers and imager stacking
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Piet De Moor
(IMEC)
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10:30
Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics
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Haemisch York
(Philips Technologie GmbH)
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10:45
Capacitively coupled active sensors in 180nm HV-CMOS technology
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Daniel Muenstermann
(CERN)
-
11:00
Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology
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JCC Clemens
(Centre National de la Recherche Scientifique (FR))
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11:15
IPDiA's Interposer and TSV solutions
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Stephane Bellenger
(Belletech)