AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Session

Chip stacking through microbump bonding

9 Apr 2013, 12:00

LNF

Conveners

Chip stacking through microbump bonding

• Michael Campbell (CERN)

43. The combined technology of TSV and SLID bond

Armin Klumpp (Fraunhofer EMFT)

09/04/2013, 12:00

45. TSV and SLID for planar Silicon Detectors

Anna Macchiolo (Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)

09/04/2013, 12:20