Name: AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors
Start: 2013-04-08T09:00:00+02:00
End: 2013-04-09T15:10:00+02:00
Location: LNF

AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

from Monday 8 April 2013 (09:00) to Tuesday 9 April 2013 (15:10)
LNF

: Sessions

: Talks

: Breaks

8 Apr 2013

9 Apr 2013

09:00

Registration and installation for exhibitors (until 12:00) ()

09:15	Integration of sensors with 3D electronics - Valerio Re (INFN) (until 11:30) ()
09:15	SiPM Interconnections to 3D electronics - Jelena Ninkovic (Max PlanckInstitute for Physics) () Slides
09:30	Perspective of the sensor interconnectivity to the TSV readout ASIC - Juha Kalliopuska (University of Helsinki Faculty of Science) () Slides
09:45	development of HV CMOS - sensors for 3D integration - Dr Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE)) () Slides
10:00	Vertical Integration techniques used for MEMS - Mr Lutz Hofmann (Fraunhofer ENAS) ()
10:15	IMEC's activities in imagers and imager stacking - Piet De Moor (IMEC) () Slides
10:30	Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics - Haemisch York (Philips Technologie GmbH) () Slides
10:45	Capacitively coupled active sensors in 180nm HV-CMOS technology - Daniel Muenstermann (CERN) () Slides
11:00	Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology - JCC Clemens (Centre National de la Recherche Scientifique (FR)) ()
11:15	IPDiA's Interposer and TSV solutions - Stephane Bellenger (Belletech) () Slides
11:30	--- Coffee Break ---

12:00	--- Lunch ---
12:50	Welcome address (until 13:00) ()
12:50	Welcome Note - Speranza Falciano (Universita e INFN, Roma I (IT)) ()
12:55	Event Overview - Jean-Marie Le Goff (CERN) () Slides
13:00	Needs of communities - Laurent Serin (Universite de Paris-Sud 11 (FR)) (until 14:40) ()
13:00	Particle Physics - Dr Ronald Lipton (Fermi National Accelerator Lab. (US)) () Slides
13:40	Astroparticle Physics - Giovanni Ambrosi (Universita e INFN (IT)) () Slides
14:00	3D needs and opportunities in X-ray detection - Heinz Graafsma (DESY) () Slides
14:20	Medical Imaging - Maria Giuseppina Bisogni (University Pisa, INFN pisa) () Slides
14:40	--- Coffee Break ---
15:10	TSV-based Vertical Interconnections - Abdenour Lounis (Universite de Paris-Sud 11 (FR)) (until 16:10) ()
15:10	Overview, state-of-the-art - David HENRY (CEA-LETI-MINATEC) () Slides
15:40	Keynote - Trend in Industry - Mike Shapiro (IBM) () Slides
16:10	--- Coffee Break ---
16:40	Through-Silicon Vias (TSV) - Hans-Gunther Moser (Werner-Heisenberg-Institut) (until 19:00) ()
16:40	CAD tools for 3D-IC and TSV-based designs - Kholdoun TORKI (CMP) () Slides
17:00	Methods for architectural design - methods of 3D-integrated systems - Andy Heinig (EAS Fraunhofer Dresden) () Slides
17:20	Method for selecting optimal 3D IC technology for detectors - Makoto Motoyoshi (Tohoku-MincroTec Co., Ltd (T-Micro)) ()
17:40	Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM - Thomas Fritzsch (Fraunhofer IZM) () Slides
18:00	Tezzaron TSV-related activities - Robert Patti (Tezzaron Semiconductor) () Slides
18:20	Packaging technologies at IMB-CNM (CSIC) - Enric Cabruja Casas (IMB-CNM (CSIC)) () Slides
18:40	3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results - David HENRY (CEA-LETI-MINATEC) () Slides
19:00	Networking Finger Food Dinner (until 21:10) ()

12:00	Chip stacking through microbump bonding - Michael Campbell (CERN) (until 12:40) ()
12:00	The combined technology of TSV and SLID bond - Armin Klumpp (Fraunhofer EMFT) ()
12:20	TSV and SLID for planar Silicon Detectors - Anna Macchiolo (Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D) ()
12:40	Frontiers in Interconnections - Michael Campbell (CERN) (until 13:20) ()
12:40	Shrinking 3D ICs - Capabilities and Frontiers of Through Silicon Via Technologies - Armin Klumpp (Fraunhofer EMFT) () Slides
13:00	Unconventional fabrication approaches create opportunities for 3D integration - Andreas Fischer (KTH) () summary
13:20	Event Summary and Roadmap for Collaborative R&D - Abdenour Lounis (Universite de Paris-Sud 11 (FR)) Christophe De La Taille (Inst. Nat. Phys. Nucl. & Particules (FR)) Mr Jean-Francois Genat (CNRS/IN2P3/LPNHE) (until 13:50) ()
13:50	--- Lunch ---

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