|
12:00
|
--- Lunch ---
|
|
12:50
|
Welcome address
(until 13:00)
()
|
|
12:50
|
Welcome Note
-
Speranza Falciano
(Universita e INFN, Roma I (IT))
()
|
|
12:55
|
Event Overview
-
Jean-Marie Le Goff
(CERN)
()
|
|
13:00
|
Needs of communities
-
Laurent Serin
(Universite de Paris-Sud 11 (FR))
(until 14:40)
()
|
|
13:00
|
Particle Physics
- Dr
Ronald Lipton
(Fermi National Accelerator Lab. (US))
()
|
|
13:40
|
Astroparticle Physics
-
Giovanni Ambrosi
(Universita e INFN (IT))
()
|
|
14:00
|
3D needs and opportunities in X-ray detection
-
Heinz Graafsma
(DESY)
()
|
|
14:20
|
Medical Imaging
-
Maria Giuseppina Bisogni
(University Pisa, INFN pisa)
()
|
|
14:40
|
--- Coffee Break ---
|
|
15:10
|
TSV-based Vertical Interconnections
-
Abdenour Lounis
(Universite de Paris-Sud 11 (FR))
(until 16:10)
()
|
|
15:10
|
Overview, state-of-the-art
-
David HENRY
(CEA-LETI-MINATEC)
()
|
|
15:40
|
Keynote - Trend in Industry
-
Mike Shapiro
(IBM)
()
|
|
16:10
|
--- Coffee Break ---
|
|
16:40
|
Through-Silicon Vias (TSV)
-
Hans-Gunther Moser
(Werner-Heisenberg-Institut)
(until 19:00)
()
|
|
16:40
|
CAD tools for 3D-IC and TSV-based designs
-
Kholdoun TORKI
(CMP)
()
|
|
17:00
|
Methods for architectural design - methods of 3D-integrated systems
-
Andy Heinig
(EAS Fraunhofer Dresden)
()
|
|
17:20
|
Method for selecting optimal 3D IC technology for detectors
-
Makoto Motoyoshi
(Tohoku-MincroTec Co., Ltd (T-Micro))
()
|
|
17:40
|
Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM
-
Thomas Fritzsch
(Fraunhofer IZM)
()
|
|
18:00
|
Tezzaron TSV-related activities
-
Robert Patti
(Tezzaron Semiconductor)
()
|
|
18:20
|
Packaging technologies at IMB-CNM (CSIC)
-
Enric Cabruja Casas
(IMB-CNM (CSIC))
()
|
|
18:40
|
3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results
-
David HENRY
(CEA-LETI-MINATEC)
()
|
|
19:00
|
Networking Finger Food Dinner
(until 21:10)
()
|
