AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

8 Apr 2013, 09:00 → 9 Apr 2013, 15:10 Europe/Zurich

LNF

During the event, the state-of-the-art on advanced interconnections will be reviewed and the needs of the Particle Physics community and other research disciplines will be addressed. Discussions among industry and academia are prone to stimulate fruitful collaborations for the future.

 

BUS SERVICE trans-APRIL__8_9.pdf

EVENT PICTURE IndustryAccademia-picture.jpg

Poster Academia-Industry-Poster.pdf IndustryAccademia-picture.jpg

Monday 8 April

Registration and installation for exhibitors

12:00 Lunch

Welcome address

1 Welcome Note

Speaker: Speranza Falciano (Universita e INFN, Roma I (IT))

2 Event Overview

Speaker: Jean-Marie Le Goff (CERN)

Slides AIME_Overview_130408.pdf AIME_Overview_130408.pptx

Needs of communities

Convener: Laurent Serin (Universite de Paris-Sud 11 (FR))

3 Particle Physics

Speaker: Dr Ronald Lipton (Fermi National Accelerator Lab. (US))

Slides 3D-Aida.pdf 3D-Aida.pptx

4 Astroparticle Physics

Speaker: Giovanni Ambrosi (Universita e INFN (IT))

Slides 20120408_Ambrosi.pdf

5 3D needs and opportunities in X-ray detection

Speaker: Heinz Graafsma (DESY)

Slides HGraafsma-AIDA-2013.pdf HGraafsma-AIDA-2013.pptx

6 Medical Imaging

Speaker: Maria Giuseppina Bisogni (University Pisa, INFN pisa)

Slides MedicalImaging_MGB_2.pdf MedicalImaging_MGB_2.pptx

14:40 Coffee Break

TSV-based Vertical Interconnections

Convener: Abdenour Lounis (Universite de Paris-Sud 11 (FR))

7 Overview, state-of-the-art

Speaker: David HENRY (CEA-LETI-MINATEC)

Slides LETI-TSV_state_of_the_art-08-04-13.pptx

8 Keynote - Trend in Industry

Speaker: Mike Shapiro (IBM)

Slides AIDA_Industry_Trends_04_03_13.pdf

16:10 Coffee Break

Through-Silicon Vias (TSV)

Convener: Hans-Gunther Moser (Werner-Heisenberg-Institut)

9 CAD tools for 3D-IC and TSV-based designs

Speaker: Kholdoun TORKI (CMP)

Slides K_TORKI_AIDA_2013.pdf K_TORKI_AIDA_2013.pptx

10 Methods for architectural design - methods of 3D-integrated systems

Speaker: Andy Heinig (EAS Fraunhofer Dresden)

Slides AIDA_PresentationFraunhoferEAS1.pdf AIDA_PresentationFraunhoferEAS1.pptx

11 Method for selecting optimal 3D IC technology for detectors

Speaker: Makoto Motoyoshi (Tohoku-MincroTec Co., Ltd (T-Micro))

12 Micro bump-bonding and TSV 3D integration expertise at Fraunhofer IZM

Speaker: Thomas Fritzsch (Fraunhofer IZM)

Slides 2013-04-08_AIDA_Frascati_IZM.pdf

13 Tezzaron TSV-related activities

Speaker: Robert Patti (Tezzaron Semiconductor)

Slides Tezzaron_Presentation_040813_AIDA.pdf Tezzaron_Presentation_040813_AIDA.pptx

14 Packaging technologies at IMB-CNM (CSIC)

Speaker: Enric Cabruja Casas (IMB-CNM (CSIC))

Slides AIDA_Academia_meets_industry_2013.pptx

15 3D Integration Technology used for Hybrid Pixel Detectors : Medipix project latest results

Speaker: David HENRY (CEA-LETI-MINATEC)

Slides LETI-Medipix_status-08-04-13.pptx

Networking Finger Food Dinner

Tuesday 9 April

Integration of sensors with 3D electronics

Convener: Valerio Re (INFN)

16 SiPM Interconnections to 3D electronics

Speaker: Jelena Ninkovic (Max PlanckInstitute for Physics)

Slides NinkovicAIDA2013.pdf

17 Perspective of the sensor interconnectivity to the TSV readout ASIC

Speaker: Juha Kalliopuska (University of Helsinki Faculty of Science)

Slides AIDA_J.Kalliopuska_pdf.pdf

18 development of HV CMOS - sensors for 3D integration

Speaker: Dr Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))

Slides Frascati_2013ivanperic.pdf Frascati_2013ivanperic.pptx

19 Vertical Integration techniques used for MEMS

Speaker: Mr Lutz Hofmann (Fraunhofer ENAS)

20 IMEC's activities in imagers and imager stacking

Speaker: Piet De Moor (IMEC)

Slides AIDAimecPdMvhandouts.pdf

21 Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics

Speaker: Haemisch York (Philips Technologie GmbH)

Slides Philips_lateral_integration_04_2013.pdf Philips_lateral_integration_04_2013.ppsx

22 Capacitively coupled active sensors in 180nm HV-CMOS technology

Speaker: Daniel Muenstermann (CERN)

Slides Muenstermann_HV-CMOS.pdf

23 Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology

Speaker: JCC Clemens (Centre National de la Recherche Scientifique (FR))

24 IPDiA's Interposer and TSV solutions

Speaker: Stephane Bellenger (Belletech)

Slides 20130408_IPDiA_Presentation_AIDA_conferences_Rome.pdf

11:30 Coffee Break

Chip stacking through microbump bonding

Convener: Michael Campbell (CERN)

25 The combined technology of TSV and SLID bond

Speaker: Armin Klumpp (Fraunhofer EMFT)

26 TSV and SLID for planar Silicon Detectors

Speaker: Anna Macchiolo (Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)

Frontiers in Interconnections

Convener: Michael Campbell (CERN)

27 Shrinking 3D ICs - Capabilities and Frontiers of Through Silicon Via Technologies

Speaker: Armin Klumpp (Fraunhofer EMFT)

Slides Ramm_Shrinking_3D_ICs_-_Capabilities_and__Frontiers_of_Through_Silicon_Via_Technologies.pdf

28 Unconventional fabrication approaches create opportunities for 3D integration

Speaker: Andreas Fischer (KTH)

summary 20130409_AIDA_s.pdf

Event Summary and Roadmap for Collaborative R&D

Conveners: Abdenour Lounis (Universite de Paris-Sud 11 (FR)), Christophe De La Taille (Inst. Nat. Phys. Nucl. & Particules (FR)), Mr Jean-Francois Genat (CNRS/IN2P3/LPNHE)

13:50 Lunch