AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Author List

• JCC Clemens (Centre National de la Recherche Scientifique (FR))
  • Author in

    Results of FE_TC4_P1, the first hybrid pixel circuit en Tezzaron-Chartered technology

• Piet De Moor (imec)
  • Author in

    IMEC's activities in imagers and imager stacking

• Andreas Fischer
  • Author in

    Unconventional fabrication approaches create opportunities for 3D integration

• York Haemisch (Philips Technologie GmbH)
  • Author in

    Digital Photon Counting Technology – horizontal integration of SPAD and CMOS electronics

• Lutz Hofmann (Fraunhofer ENAS)
  • Author in

    Vertical Integration techniques used for MEMS

• Juha Kalliopuska (University of Helsinki Faculty of Science)
  • Author in

    Perspective of the sensor interconnectivity to the TSV readout ASIC

• Armin Klumpp (Fraunhofer EMFT)
  • Author in

    Shrinking 3D ICs - Capabilities and Frontiers of Through Silicon Via Technologies

  • Author in

    The combined technology of TSV and SLID bond

• Anna Macchiolo (Max-Planck-Institut fuer Physik (Werner-Heisenberg-Institut) (D)
  • Author in

    TSV and SLID for planar Silicon Detectors

• Daniel Muenstermann (CERN)
  • Author in

    Capacitively coupled active sensors in 180nm HV-CMOS technology

• Jelena Ninkovic (Max PlanckInstitute for Physics)
  • Author in

    SiPM Interconnections to 3D electronics

• Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))
  • Author in

    development of HV CMOS - sensors for 3D integration