AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Name: AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors
Start: 2013-04-08T09:00:00+02:00
End: 2013-04-09T15:10:00+02:00
Location: LNF

8–9 Apr 2013

LNF

Europe/Zurich timezone

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The combined technology of TSV and SLID bond

9 Apr 2013, 12:00

20m

LNF, Auditorium Touschek

Chip stacking through microbump bonding

Armin Klumpp (Fraunhofer EMFT)

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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

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The combined technology of TSV and SLID bond

LNF, Auditorium Touschek

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AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

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