AIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors

Session

TSV-based Vertical Interconnections

8 Apr 2013, 15:10

LNF

Conveners

TSV-based Vertical Interconnections

• Abdenour Lounis (Universite de Paris-Sud 11 (FR))

37. Overview, state-of-the-art

David HENRY (CEA-LETI-MINATEC)

08/04/2013, 15:10

38. Keynote - Trend in Industry

Mike Shapiro (IBM)

08/04/2013, 15:40