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International Workshop on Semiconductor Pixel Detectors for Particles and Imaging (PIXEL2014)

1–5 Sept 2014
Niagara Falls, Canada
Canada/Eastern timezone

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Session

Cooling, Interconnections, Radiation Tolerance

4 Sept 2014, 14:00
Niagara Falls, Canada

Niagara Falls, Canada

Sheraton on the Falls

Conveners

Cooling, Interconnections, Radiation Tolerance

  • Markus Keil (CERN)

Presentation materials

There are no materials yet.

  1. 164. Evaporative CO2 Microchannel Cooling for the LHCb VELO Pixel Upgrade
    Oscar Augusto De Aguiar Francisco (Univ. Federal do Rio de Janeiro (BR))
    04/09/2014, 14:00
    ORAL
    The LHCb Vertex Detector (VELO) will be upgraded in 2018 to a lightweight, pixel detector capable of 40 MHz readout and operation in very close proximity to the LHC beams. The thermal management of the system will be provided by evaporative CO2 circulating in micro channels embedded within thin silicon plates. This solution has been selected due to the excellent thermal efficiency, the...
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  2. 176. RD53 investigation of CMOS radiation hardness up to 1Grad
    Mohsine Menouni (Centre National de la Recherche Scientifique (FR))
    04/09/2014, 14:30
    ORAL
    This talk will review progress and status of testing of deep submicron CMOS technology for tolerance to radiation with total ionizing dose up to 1Grad, and also for tolerance to single event effects. Multiple prototypes have been fabricated and tested with x-rays, gamma rays, and protons. Devices tested range from single transistors to full circuits. A summary of results obtained so far will...
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  3. 183. Silicon as Pixel Sensor Material at Extreme Fluences up to 10^17 n/cm^2
    Marko Mikuz (Jozef Stefan Institute (SI))
    04/09/2014, 15:00
    ORAL
    Raising the electric field so as to provoke charge multiplication of electrons has enabled silicon to provide measurable signals from sensors irradiated to unprecedented radiation levels up to 1.6x10^17 n_eq/cm^2, making it a contender also for HL-LHC very forward tracking and calorimneters. A simple scaling of collected charge vs. applied bias has been established experimentally for fluences...
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  4. 184. The RD50 Activity in the Context of Future Pixel Detector Systems
    Gianluigi Casse (University of Liverpool (GB))
    04/09/2014, 15:30
    ORAL
    The CERN/RD50 collaboration is dedicated to the radiation hardening of semiconductor sensors for future super-collider needs. It is therefore natural that the findings of our collaboration in this field are relevant to the pixel devices for the LHC experiment upgrades. A summary of the consistent amount of results on radiation tolerance enhancement of silicon sensors from RD50 will be...
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  5. 120. 3D Integration Technology for Pixel Detector and Image Sensor using 3-μmφ Au Cone Bump Junctions
    Makoto Motoyoshi (Tohoku-MincroTec Co., Ltd (T-Micro))
    04/09/2014, 16:20
    ORAL
    Abstract A 3D IC is an effective solution for reducing the manufacturing costs of advanced 2D LSI while ensuring equivalent device performance and functionalities. This technology allows a new device architecture of stacked detectors/sensor devices with a small dead sensor area and facilitates hyper-parallel data processing. In pixel detectors or image sensor devices, many transistors are...
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  6. 207. 2.5D and 3D Integrated Circuit Technology Capablilities and Industry Readiness
    Robert Patti (Tezzaron Semiconductor Corp.)
    04/09/2014, 16:50
    ORAL
    The term 3D integrated circuit covers a wide swath of technologies today. It can mean anything from chip stacking to interposers or “2.5D integration”, to TSV’d wafer stacking or even the latest bleeding edge technology push into monolithic 3D devices. No matter which type, with scaling’s advantages rapidly eroding, 3D integrated circuits appear to be gaining traction in the market. Most...
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  7. 135. New Concept For Forward Tracking In LHC Experiments
    Aliaksandr Pranko (Lawrence Berkeley National Lab. (US))
    04/09/2014, 17:20
    ORAL
    Extensive discussions are underway to refine the physics goals and scope of detector upgrades for the future LHC runs, following the Higgs boson discovery. New opportunities for improving performance of the ATLAS and CMS tracking detectors in the very forward region are of particular interest to future Higgs and other measurements, which are central to the ATLAS and CMS physics programs. We...
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