3–4 Mar 2009
CERN
Europe/Zurich timezone

Flip-chip and packaging technologies

4 Mar 2009, 12:00
25m
500/1-001 - Main Auditorium (CERN)

500/1-001 - Main Auditorium

CERN

400
Show room on map

Speaker

Oswin Ehrmann (Fraunhofer IZM)

Presentation materials