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    PhaseII discussion

    → Europe/Zurich
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    Hi all,

    Below are the minutes of our flex discussion on Monday.
    1) Whether the module assembly include sensor+FE chip bump bonding,
       attachment onto flex plus wire bonding, and module testing
       - some groups will do the full procedure (e.g. KEK)
       - ITK is also looking for vendors to do sensor+FE chip bump bonding
       - so other groups can focus on attaching sensor+FE onto flex,
         wire bonding, and module testing

    2) We agree to start doing only attaching sensor to flex, we do not
       need to care which flex we use
       - however for the later stage of module testing, we will need to
         know the functionality of the FE chip
       - From speaking to Susanne Kuehn, most groups are playing with
         FEI4 chip. Newer chip FE65-p2 is now available. However the
         final version will not be available until end of 2017.
         - will try to find the information on FEI4 and FE65-p2

       - For gluing, Ming-Lee will find out more about the type of glues to use :
         Araldite 2011, UHU EndFest 300, Epolite

       - Susanne Kuehn gave us 10 dummy glass sensors and also showed us
         CERN test-bench yesterday. Right now they have a setup with vaccume line,
         jigs to hold the flex and sensor. They are also learning how to apply glue.
         For this practice they are using Kapton (cut into the shape of a flex)
         to mimic the flex to practice gluing. One important thing is to control
         the amount of glue to apply and the thickness (to reduce material).

    3) Talk to Steve McMahon
       - We discussed whether we should talk to Steve about our status now on
         the pixel module
       - We were thinking maybe during the ATLAS upgrade week
         (November 14-18 at CERN) could be a good time when we are clearer in our
         plans.
         - Maybe Ming-Lee or Chih-Hsun can come to talk to Steve.

       - This week is ATLAS week, and tomorrow there is an upgrade session.
         I am also thinking maybe Rachid and I can have a casual chat with Steve
         about our status.

    4) Power supply
       - we have not followed up on this after Ming-Lee presented his idea of making
         high-density LV/HV cables, but was not accepted by ITK
       - Ming-Lee said he has been working on multi-channel power supply.
         However prefer not to mention about this to the ITK group before finding
         out what is the current situation (whether other groups are also developing
         power supplies).
       - Ming-Lee will contact Tony Weidberg to find out the situation.


    Action to follow up
    ===================
    1) Ming-Lee  : find out about types of glue to use
    2) Song-Ming : information on FEI4 and FE65-p2 chips
    3) Song-Ming, Rachid : casual talk with Steve tomorrow during upgrade session
    4) Ming-Lee  : contact Tony Weidberg to find out the situation on power supplies

    I hope that we can also start setting up a test-bench :
    1) do we have a room ?
    2) non-oil vaccum pump, and setup vaccum lines
    3) try to get some design of making the jigs, or we can design jigs based
       on the Bonn flex dimension.
       - will discuss with Chih-Hsun or Ming-Lee.


    Regards,
    Song-Ming

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