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QA/QC meeting - US+UK
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Executive summary:
- Next meeting: Wednesday 6 June at 5 CERN/4 UK/11 AM Eastern
- Meeting focus: production flow testing (and process controls)
- Check the mail for "homework," particularly for glue protocols (Gerrit/Jens) and mechanical tests (Dave)
- Update from discussion with Bernd last Thursday (next discussion this Thursday, 7 June)
- Our action items list
Details below. Thanks everyone.
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As Jens is at a tooling meeting on Monday and Tuesday, we will meet again on Wednesday 6 June 2018 at 5 PM CERN/4 PM UK/11 AM Eastern, based on the doodle poll results. This meeting will focus on production flow testing and process controls. In particular, we need to develop pass conditions for each test.
In addition, we decided at the last meeting to pay special attention to our glue procedures (see "Glue-related" list under our Action Items). Gerrit, it would be useful to know more about the US plan for de-gassing with the new mixer system and how the mixer system works. Jens, do you have any thoughts on the batch testing frequency given the 6-months' shelf life of the glue?
Dave, if you have a list of mechanical tests (not designs, just a list of what sort of things we should check regularly on loaded staves?), it would be useful to discuss this on Wednesday as Bernd was also interested.
As we want to keep the meeting short, it is important that we move on from the equipment discussion for now, so we will start from Slide 24 on Wednesday (production flow testing).
Lastly, a short update on last Thursday's discussion with Bernd and Jens:
- We compared Andy's general document based on AUW (https://docs.google.com/document/d/1LNU9raIf5ZO4TLNy7axj4ubFIddhQNoTAFZRuzH1neQ/edit?usp=sharing) with our evolving set of slides
- Some differences with Nigel concerning glue height definition (wants <115 um). Plan is to ignore this for now and see how mounting goes
- I missed the weld test when I made the initial set of slides. That's a key QA item on a partial object
- Bernd pointed out that Petals are mounting their EOS first, while we do so after module mounting
- Dave or Gerrit said in the US Technical Meeting on Friday that we would mount the EOS first when we build the most recent stave, so this isn't an issue
- Jens to think about whether or not this matters
- Particular interest in an appropriate envelope test (obviously this depends on object geometry, etc, and we won't do the same thing. We want to make sure we are aligned in spirit)
- Slot gauge?
- Non-destructive solution?
- Bernd: just measure easily the highest point on each side?
- Short term objectives focus on getting ready for the Strips QA/QC meeting in 2 weeks
- Filling out a template for the meeting: https://docs.google.com/spreadsheets/d/1dUnL1y2f_MNaEGCIfEVareIH9xoNaCqD3oqVgnQ-weA/edit?usp=sharing
- Follow up discussion planned for Thursday 7 June (time TBD...)
Bernd also questioned whether procedure designed to ensure a high quality object is relevant to the QC discussion. I have been including it based on my nascent understanding of what QC is (thanks, Jens, Dave, Gerrit, and Wikipedia!). If it is better removed, it's fine with me, though we still should iron out our UK/US procedural alignment (again, we don't need identical, but we should agree on the spirit for sure).
From the last meeting:
- Action items
- Review summary slides and update with your thoughts (Laura, Jens, Gerrit, Dave, Gabriella)
- https://docs.google.com/presentation/d/1avP2AoiZYoNowDMQeG4fgVd6hTVdPzoMvl1brDk44so/edit?usp=sharing
- In particular, Jens/Gerrit/Dave - try to fill in the gaps where mentioning {Jens}/{BNL}/{Gerrit}
- Gaps include
- Pull tester plans details
- Local support handler system for wirebonding
- Glue-related (Gerrit, Jens, Laura)
- Frequency of Glue batch testing - need to define this
- Glue degassing procedure plan
- Gerrit to fill in his details on how he deposits the glue from pre-mixed cartridges
- Precision scale for full stave mass vs mass of glue syringe vs volumetric dispensing
- US glue measurement test on 13-module stave [[not immediate]]
- Weigh syringe before/after & see how easy this fits with assembly system
- US glue measurement test on 13-module stave [[not immediate]]
- Mechanical tests (Dave)
- Envelope test equipment and procedure
- Other mechanical tests as QA? QC?
- Investigate SmartRay 3D line scanner (Jens)
- Database inputs and file size constraints (Jens? Hannah? Laura?)
- Things to remember in the background:
- Bond wire height specification (Jens, Gerrit? Alessandro?)
- EOS testing plan (P. Goettlicher, M. Stanitzki)
- Encapsulation and plasma cleaning: advantages, disadvantages
- Communicate progress with Bernd and collate Petals input (Jens, Hannah)
- Jens already contacted Bernd
- Original summaries in part based on the AUW April 2018 report on petals QA/QC from Nigel Hessey
- Hoping for follow up before weekend
- Review summary slides and update with your thoughts (Laura, Jens, Gerrit, Dave, Gabriella)
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