Conveners
Session 8: 3D Sensors
- Gian-Franco Dalla Betta (INFN and University of Trento)
In this presentation results obtained in beam test experiments with 3D columnar pixel sensors interconnected with the RD53A readout chip will be reported. The 3D pixel sensors were produced at FBK foundry in an R&D agreement with Istituto Nazionale di Fisica Nucleare (INFN, Italy). A few modules, each consisting of a 3D pixel sensor bump-bonded to an RD53A chip, were irradiated at the CERN...
A new generation of 3D pixel detectors with high granularity and thin active substrates is being developed for the upgrade of the ATLAS Inner Tracker (ITk) at HL-LHC. The new sensors will have to fulfil the requirements for the innermost pixel layers in terms of radiation hardness and rate capabilities.
Two productions of 3D sensors compatible with the new RD53A chip (the prototype of the...
The upcoming High Luminosity LHC (HL-LHC) puts stringent requirements on the tracking detectors situated closest to the interaction point in the planned Inner Tracker (ITk) of the ATLAS experiment. 3D pixel detectors have been proposed as a candidate for the innermost layers of the ITk since these detectors decouple the sensor thickness and the inter-electrode spacing, effectively increasing...
Minimisation of insensitive volume in silicon sensors is highly demanded in many applications for high energy physics, structural biology, synchrotron experiments and nuclear medicine. A large contribution to this insensitive volume is the guard rings and current terminating structures required in conventional planar silicon sensor that surround the chip periphery. The maximum size of silicon...
