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DT Training Seminars
Pixel detector hybridisation alternatives to bump-bonding
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Europe/Zurich
32/1-A24 (CERN)
Description
Hybrid pixel detectors are the standard technology used for many HEP detectors for the vertex detection systems.
As CMOS technology advances with smaller and smaller feature sizes, the pixel interconnection techniques, from the sensor to read-out chips, must keep with the pixel miniaturisation. The current standard hybridisation technique with the use of bump-bond involves a complex and expensive photolithographic process and can be a bottleneck to reach smaller pixel sizes.
The seminar will introduce alternative hybridisation techniques suitable for in-house detector assembly, which are based on different types of adhesives. The two approaches discussed in detail are either using capacitive coupling through thin non-conductive adhesive layers between the sensor and readout pixels, or direct electrical connections through Anisotropic Conductive Films (ACF).