BGI Team Meeting

Wednesday 13 May 2020, 14:00 → 16:00 Europe/Zurich

Present: Hampus, James, Josh.

PS BGI 

Actions from previous meeting

Done:

• James & Josh will prepare the tank for the BE-RF impedance measurement on Wednesday 20th May, with Friday 22nd authorised in case of problems.
• Swann sent Didier the MkIII detector STEP files for incorportation into the CATIA model.
• James contacted Wil concerning aC coating.
• Hampus contacted Christos & William to setup the design review for the  SFP+ FMC mezzanine.

Still To-Do:

• Communicate in-vacuum electronics assembly & wire-bonding requirements ( Swann when he returns ).
• Status of flex cables ( Swann when he returns ).

Mechanics

• Meeting last week with Emilien Rigutto to discuss production of the upgraded BGI-Horizontal mechanics. Idea is to produce enough parts for 3 x complete instruments, using 2 x spare vacuum flanges & re-using an existing flange assembly. Action: Check stock of Dsub-,  Dsub-78 & Kings-HV electrical vacuum feedthroughs (James & Josh).

Readout electronics & Software

• We will have a mini-workshop on the morning of Wednesday 10th June ( date t.b.c. ) to review: the instrument functional requirements; firmware; software drivers; FESA classes; Expert GUI & analysis software. The aim will be to evaluate our current status; identify improvements & generally to promote understanding & communication between all involved. 
• Requests for electronic design office / production work should be communicated directly by the requester to the design office, with William in 'cc. Action: Hampus to communicate jobs for 1) SFP+ FMC board design & production & 2) VPB / QuadGBTx design update & production.
• Steen & Hampus need a FEC & back-end to be setup in 865 for FESA & driver developments. Action: Hampus to do this week of Monday 29th May.   

SPS BGI

Actions from previous meeting

Still To-Do:

• Move new HV system to 867 and setup instrument & SILECS to provide HV control (James, Josh & Hampus).

Timepix3-BLM

• PCB design almost complete. Would be good if Swann could take a look when he's back.
• Design for a mechanical holder has been developed based on extruted pieces (from https://lincolnbinns.com/customisation/custom-aluminium-enclosures/custom-e-case-enclosures.html), which includes an ecosystem of parts to allow, for example, connectiotion to DIN rails.  Casing above the Timepix3-BLM will be removed and replace with a window with low material budget - to be decided what. All connectors ( RJ45, power, bias & DAC-OUT ) are on one side. Possibility to use similar mechanics to combine more than one PCB "layer" in a box to create a telescope-like configuration.

Other 

• To help co-ordinate tasks between us - particularly during teleworking - we will try again to use the BGI Trello board.