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TWEPP 2020 User Group Meetings

21–24 Sept 2020
Europe/Zurich timezone

Session

Micro-electronic user group

22 Sept 2020, 14:00

Presentation materials

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  1. 14. Welcome
    Kostas Kloukinas (CERN)
    22/09/2020, 14:00
  2. 15. ASIC support & Foundry Services News
    Alessandro Caratelli (CERN, EPFL)
    22/09/2020, 14:10
  3. 16. CHIPS: CERN-HEP IC design Platform and Services
    Xavi Llopart Cudie (CERN)
    22/09/2020, 14:30
  4. 17. EP R&D WP: CMOS Technologies for Future Experiments
    Kostas Kloukinas (CERN)
    22/09/2020, 14:50
  5. 33. 28nm CMOS Mixed Signal Design Kit
    Ms Alessandra Fioriti (CERN)
    22/09/2020, 15:10
  6. 18. EUROPRACTICE EDA Tools for the HEP Community
    Manager, Europractice Design Tools
    22/09/2020, 15:40
  7. 19. Semiconductor process selection from ESD perspective: FinFET, SOI or CMOS?
    Mr Benjamin Van Camp, CTO SOFICS (SOFICS solutions for ICs)
    22/09/2020, 16:10

    Many fabless companies struggle with the selection of their next process platform: FinFET or thin film SOI or in CMOS?
    Though on-chip protection against Electrostatic discharge (ESD) should not determine the choice of technology, it can impact design choices and ultimately cost of the product. For efficient ESD protection, 2 elements are important: the ESD strategy, and the vulnerability of...

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  8. 20. Open Discussion
    22/09/2020, 16:40
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