Description
John U. Knickerbocker IBM Research Division, Thomas J. Watson Research Center, Route 134, Yorktown Heights, New York 10598 (knickerj@us.ibm.com).
Dr. Knickerbocker is an IBM Distinguished Engineer; he is the manager of 3D Integration including Die Stacking & Silicon Packaging at IBM Research. He received his PhD degree in 1982 from the University of Illinois studying Materials Science & Engineering. He has over 27 years experience in IBM Microelectronics and IBM Research. He has authored or co-authored 180 patents or patent applications and more than 50 technical papers and publications. He serves as a member of the SEMATECH 3D working group and is an active member of IEEE Technical Society.
