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Reunion Presencial de Coordinacion FPA2017
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sala de reuniones del edificio nuevo (IMB-CNM)
sala de reuniones del edificio nuevo
IMB-CNM
DECISION LIST:
Extending the FPA2017 18 month to be requested after the CMS revision of the calendar.
Epitaxial wafers are NOT an option for the production.A
Adopt a more symmetric metal signal routing for the of the rectangular cell.
CMS Pre-production run
Number of wafers: 4 (270um) + 4 wafers ( 350) SiSi
After checking the actual number of wafer there were 30 wafers of 270 and 1 of 350 um then we decided
to have a run of 270um (10 wafers).
Optimization of the cell layout (metal routing between junction and bond pad for 25x100) (Giulio)
Run to be ready for electrical characterization before December.
3D ACTION LIST:
- Define wafer ordering calendar, assuming a delay of 24 months to ensure the availability of the wafer during
production (150 wafers in total for CMS and ATLAS). CRITICAL PATH. (post reunión oferta de ICE-MOS para comprar 75 obleas mas y una oferta de la empresa D&X Japan para 25 obleas aceptada )
- Search for alternative providers of SiSi wafers.(Done D&X Japa)
- Follow up the results on the planarity and inverse current of the engineering run # 12939. To be completed in ?
- Check the feasibility and cost of the wafer thinning and back-side metallisation (Gervasio). (Done IZM can do it
but they need more precise specs for cost estimate)
- Contact IZM and ETHZ to assemble 2x1 3d pseudo modules using ITA HDI (Gervasio). Five modules.
(Done, ETHZ will assemble the five modules, Malte will keep two of them)
- Retrive undiced test structures (diodes) from IZM from run #11119 (Gervasio).
Requested to be sent to CNM (Done)
- Definition of the Irradiation plan:
- Ask Anna the irradiation parameters at Bern to do the irradiation at CNA (similar cyclotron). Irradiate 2 at CNA (1e16). (Iván)
- Irradiate 2 sensor at KIT 1e16.(Gerva)
- Irradiate 6 sensors at FERMILAB 1e16(3), 2e16(3). (3= 2 square + 1 rectangular)(Gerva)
LGADs ACTION LIST:
LGAD 150 mm wafer runs
Run 11486 Gain measurement of single diodes SoI wafers for process calibration (device under measurement).
Observed issue with back-side contacts due to peeling of Al layer.
Run 13002 single diodes EPI (first LGAD EPI ever at CNM) to be ready by March 2020
Run Common Run ATLAS/CMS. CNM940 to be ready by June 2020
LGAD 100 mm wafer runs.
run #10478 wafer 5 ??????
AIDA-2020 v1 to complete the radiation tolerance study by February 2020
AIDA-2020 v2 three wafers post-processed for back-side metallization and IV and CV to have them ready by February 2020
ILGAD 100mm wafers runs:
- Define the manufacturing calendar of thin ILGAD (RD50 project).
- Contact M. Moll about the status of the RD50 ILGAD project.
POWER SYSTEM ACTION LIST:
- RD53 power stage simulation of different operation scenarios.
- EMC inmunity test of future HDI prototypes and serial chains.
– 2x1 TBPX-HDI design & 2x1 & 2x2 TBPX-HD Simulations
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