2–4 Mar 2022
University of Freiburg (Virtual)
Europe/Zurich timezone

Session

3D Sensors

5: 3D
3 Mar 2022, 16:25
Virtual (Zoom Only) (University of Freiburg (Virtual))

Virtual (Zoom Only)

University of Freiburg (Virtual)

Conveners

3D Sensors

  • Gian-Franco Dalla Betta (INFN and University of Trento)

Presentation materials

There are no materials yet.

  1. Leena Diehl (Albert Ludwigs Universitaet Freiburg (DE))
    03/03/2022, 16:25
    3D Sensors
    Oral

    Collider experiments as the upcoming high-luminosity LHC or the future FCC will increase the demands of the detectors used for tracking. In the FCC, sensors will not only face fluences of up to $1\cdot10^{17}~n_\mathrm{eq}/\mathrm{cm}^2$ , but also high pile-up scenarios. Thus sensors are needed which have a high radiation tolerance, but also an excellent time resolution while still providing...

    Go to contribution page
  2. Dr Vagelis Gkougkousis (CERN)
    03/03/2022, 16:45
    3D Sensors
    Oral

    The proven potential of 3D geometries at higher than $10^{16}$ $n_{eq}/cm^{2}$ radiation fluences, in combination with a small cell approach, makes them an excellent choice for a combined precision timing tracker. In this study, the timing resolution of a single 50 x 50 $\mu m$ 3D pixel cell is presented in various temperatures through charge collection measurements with discrete electronics...

    Go to contribution page
  3. Giulio Bardelli (Universita e INFN, Firenze (IT))
    03/03/2022, 17:05
    3D Sensors
    Oral

    Columnar pixel sensors, also known as 3D sensors, are considered for the innermost layers of the tracking detectors of the CERN Large Hadron Collider High Luminosity upgrade (HL-LHC). In the case of the CMS experiment, the first layer of pixel detectors will be installed at about 3cm distance from the beam pipe; it will be exposed to unprecedented fluences of up to 2E16 neq/cm2 (1MeV...

    Go to contribution page
  4. Dr Marco Povoli (SINTEF MiNaLab)
    03/03/2022, 17:25
    3D Sensors
    Oral

    SINTEF MiNaLab recently completed its sixth fabrication run of 3D pixel detectors as pre-production for the ATLAS ITk upgrade. The common sensor layout for RD53B sensors in 50x50 (1E) configuration was used. In addition, sensors compatible with RD53A readout as well as 3D diodes and 3D strips were included in the wafer layout. In this iteration of the technology, the active-edge was removed...

    Go to contribution page
  5. Susan J Dittmer (University of Illinois at Chicago (US))
    03/03/2022, 17:45
    3D Sensors
    Oral

    For the high luminosity upgrade of the LHC, the CMS experiment is considering implementing the innermost layers of its inner tracker with 3D pixels. This technology should allow the detector to operate safely at unprecedented fluences that can be as high as O(2e16 Neq/cm2). In this study we present results of pixelated 3D sensors fabricated at IMB-CNM and interconnected to the RD53A...

    Go to contribution page
Building timetable...