ACES 2011 - Common ATLAS CMS Electronics Workshop for SLHC

Session

Technologies 2

10 Mar 2011, 10:50

222/R-001 (CERN)

Conveners

Technologies 2

• Philippe Farthouat (CERN)
• Geoff Hall (Imperial College London)

Presentation materials

Video in CDS

Video in CDS

32. Advanced packaging in LETI

David Henry (CEA)

10/03/2011, 10:50

33. Laminate Based System in Package (SiP) Utilizing High Density Interconnect (HDI) Substrates in High Reliability Applications

Ron Nowak (Endicott)

10/03/2011, 11:25

34. Experience with the use of C4

Ken Wyllie (CERN)

10/03/2011, 12:00

36. Bump bonding large and thin chips

Thomas Fritzsch (Fraunhofer IZM)

10/03/2011, 12:20