RD50 CMOS Sensor Meeting

Thursday Apr 13, 2023, 11:00 AM → 12:40 PM Europe/Zurich

Zoom

11:00 AM → 11:20 AM RD50-MPW4 - Simulations and design

• MPW submission date 08.05.23, estimated delivery date 02.11.23 (confirm w/ LFoundry)
• Potential MLM submission (instead of an MPW submission)
• Analogue and digital wishlist w/ chip improvements (and PCB wishlist)
• RD50-MPW3/4 post-layout simulations w/ simplified double column
• Organise RD50 funding request (get quotations from LFoundry and IBS)

Speakers: Bernhard Pilsl (Austrian Academy of Sciences (AT)), Chenfan Zhang (University of Liverpool (GB)), Chenfan Zhang (University of Liverpool), Helmut Steininger (Austrian Academy of Sciences (AT)), Patrick Sieberer (Austrian Academy of Sciences (AT)), Samuel Powell (University of Liverpool (GB)), Sinuo Zhang (University of Bonn (DE)), Sinuo Zhang

RD50-MPW4 wishlist

11:20 AM → 11:30 AM RD50-MPW3 - 2023 test beams

• Plan to keep DESY test beam and cancel CERN test beam
• People interested in joining the DESY test beam crew please add their names to the CodiMD

Speakers: Christian Irmler (Austrian Academy of Sciences (AT)), Eva Vilella Figueras (University of Liverpool (GB)), Jan Hammerich (University of Liverpool), Jan Patrick Hammerich (University of Liverpool (GB)), Patrick Sieberer (Austrian Academy of Sciences (AT)), Uwe Kraemer

north_area_h6_h8_draft_schedule_v050_20230313_1930.pdf

Test beam plan

11:30 AM → 11:55 AM BTTB Workshop - Practice talk

• Test-Beam Instrumentation and Results of the RD50-MPW3 HV-CMOS Detector

Speaker: Bernhard Pilsl (Austrian Academy of Sciences (AT))

bttb11_pilslb_preliminary.pdf

11:55 AM → 12:00 PM AOB

• TWEPP conference --> abstracts deadline is 30.04.2023
• PSD conference --> abstracts deadline is 01.06.2023

PSD13

TWEPP2023

12:00 PM → 12:30 PM RD50-MPW4 - Detailed design

• Pad ring
• Top chip floorplan
• Chip size

Speaker: Eva Vilella Figueras (University of Liverpool (GB))