RD50 CMOS Sensor Meeting

Thursday Apr 20, 2023, 11:00 AM → 12:40 PM Europe/Zurich

Zoom

11:00 AM → 11:20 AM RD50-MPW4 - Submission and general design details

• MPW submission date 08.05.23 (confirmed by LFoundry)
• Discussion around proposed substrate resistivity, final thickness, backside processing method and number of wafers
• Waiting for LFoundry quotation to complete and distribute RD50 funding request
• Update on general design aspects
• Chip design wishlist

Speakers: Bernhard Pilsl (Austrian Academy of Sciences (AT)), Chenfan Zhang (University of Liverpool), Chenfan Zhang (University of Liverpool (GB)), Helmut Steininger (Austrian Academy of Sciences (AT)), Patrick Sieberer (Austrian Academy of Sciences (AT)), Samuel Powell (University of Liverpool (GB)), Sinuo Zhang, Sinuo Zhang (University of Bonn (DE))

RD50-MPW4 wishlist

11:20 AM → 11:30 AM RD50-MPW3 - 2023 test beams

• People interested in joining the DESY test beam crew please add their names to the CodiMD
• We have cancelled the CERN test beam

Speakers: Christian Irmler (Austrian Academy of Sciences (AT)), Eva Vilella Figueras (University of Liverpool (GB)), Jan Hammerich (University of Liverpool), Jan Patrick Hammerich (University of Liverpool (GB)), Patrick Sieberer (Austrian Academy of Sciences (AT)), Uwe Kraemer

Test beam plan

11:30 AM → 11:40 AM External influence on calibration results

There is a jump in the ToT after moving the MPW2 to a different lab.

Speaker: Douwe Jesse Lars Nobels (Nikhef National institute for subatomic physics (NL))

External influence on calibration results.pdf

11:40 AM → 11:45 AM AOB

• TWEPP conference --> abstracts deadline is 30.04.2023
• PSD conference --> abstracts deadline is 01.06.2023

PSD13

TWEPP2023

11:45 AM → 12:15 PM RD50-MPW4 - Specific design details

• Pad ring
• Top chip floorplan
• Chip size

Speaker: Eva Vilella Figueras (University of Liverpool (GB))