Conveners
Packaging and Interconnects
- Ken Wyllie (CERN)
- Magnus Hansen (CERN)
Particle tracking and imaging detectors are becoming increasingly complex, driven by demands for densely integrated functionality and maximal sensitive area. These challenging requirements can be met using 3D interconnect techniques widely used in industry. In this paper, we present the results of an evaluation of the 3D through-silicon-via (TSV) technology, using the Timepix4 integrated...
In order to reduce the material budget and maximize the active area of sensors used in future experiments, a 30um thick lightweight flex has been produced. The presented fabrication technology coupled with novel interconnection technologies allows for compact packaging with a direct attachment of the chip connection pads to the flex. Beyond interconnection technologies such as Anisotropic...
The bus tapes required for ATLAS ITk strips are very challenging because of the data rates and lengths of the transmission lines. The impedances need to be very well controlled. The designs must allow for sensor operation at 500V. The required quality of the Ni/Au plating for wire bond pads is difficult to achieve for such large tapes. The tapes must be radiation tolerant and we have seen...
