1–6 Jul 2025
Omni Boston Hotel at the Seaport
US/Eastern timezone

Thu-Af-Po.08-05: Fast cooling pulsed magnet using high thermal conductive reinforcement layers

3 Jul 2025, 14:00
2h
Ensemble Ballroom, Level 2

Ensemble Ballroom, Level 2

Speaker

Luchen Wei (Huazhong University of Science and Technology)

Description

Accelerating the cooling rate of pulsed magnets has a significant impact on the efficiency of physics experiments. Inserting axial liquid nitrogen cooling channels in the magnet is a common method to accelerate the cooling rate. However, the cooling channels prevent stress from being transmitted between the layers of the magnet, which reduces the structural strength and increases the design complexity. Therefore, by adding aluminum nitride (AlN) and graphene high thermal conductive fillers to epoxy (EP) used for impregnating poly(p-phenylene-2,6-benzoxazole) (PBO) fiber reinforcement layers, we propose fast cooling magnets with high thermal conductive reinforcement layers to accelerate the cooling rate of the magnet without affecting the transmission of stress. The effects of different filler content on the mechanical properties, thermal conductivity and electrical insulation properties of the reinforced layer were tested, and the differences in cooling rate, structural strength and service life between the magnet with high thermal conductive reinforced layers and the common magnet were studied. This technology can significantly enhance the cooling speed of the magnet while minimizing structural strength loss, and can also be integrated with cooling channels to further expedite the cooling speed of the magnet. Subsequently, this technique will be applied to a 55 T pulse magnet with 300 ms pulse duration. The simulation results show that the cooling time of the magnet will be reduced from 180min to 30min.

Authors

Luchen Wei (Huazhong University of Science and Technology) Wenqi Wei (Huazhong University of Science and Technology) Tao Peng (Huazhong University of Science and Technology) Xiaotao Han (Huazhong University of Science and Technology)

Presentation materials

There are no materials yet.