1–6 Jul 2025
Omni Boston Hotel at the Seaport
US/Eastern timezone

Thu-Mo-Po.04-06: Quench current and thermal distributions in a no-insulation REBCO pancake coil with metallic shunting on the winding surfaces

3 Jul 2025, 08:45
2h
Ensemble Ballroom, Level 2

Ensemble Ballroom, Level 2

Speaker

Fangliang Dong

Description

In this paper, we present investigation of the impact of the surface shunting on the current and thermal distributions within no-insulation (including metal-insulation) REBCO coils, particularly in relation to quench and overcharge events. The metallic surface shunt serves as an additional current bypass outside of the winding, complementing the turn-turn bypass present inside metal-insulated windings. This modification may alter both the electromagnetic and thermal characteristics of the coil. To further investigate this effect, we will fabricate a demonstration coil and evaluate the influence of various shunting materials and dimensions, including foil thickness and winding surface coverage area, through experiments. These results will be compared with corresponding simulations for quench and overcharge scenarios. We expect that the insights gained from this investigation will be valuable for the design of very high-field magnets for various applications, including physics experiments, materials science, and nuclear magnetic resonance (NMR).

Author

Co-authors

Liangjun Shao (MIT PSFC) Dr Dongkeun Park (Massachusetts Institute of Technology)

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