Speaker
Description
The fabrication of superconducting coils using high-temperature superconductor (HTS) tape necessitates the use of soldering processes to join sections of tape or to connect the tape to the current lead. During this process, flux is commonly used to remove the oxide layer from the copper stabilizer to improve the soldering quality. However, residual flux remaining on the surface or permeating between the turn-to-turn layers after soldering can lead to corrosion and contamination over time, which significantly degrades the properties of the tape and current lead. These issues are one of the primary causes of reduced long-term reliability in superconducting applications. In this study, two types of solder flux with different compositions were used to fabricate superconducting coils, after which the surface of the coils and the electrical characteristics of the coils were monitored and compared over time. We systematically investigated the effects of the type of flux and the temporal progression of residual flux on the material degradation and the performance and stability of superconducting coils.
