1–6 Jul 2025
Omni Boston Hotel at the Seaport
US/Eastern timezone

Wed-Af-Po.04-09: HTS tapes joining techniques and its I-V characterization at 77 K

2 Jul 2025, 14:30
2h
Ensemble Ballroom, Level 2

Ensemble Ballroom, Level 2

Speaker

Sumit Chand (Research Scholar)

Description

In this study, different types of joints (lap joint and bridge joint) using commercially available second-generation (2G) high-temperature superconductor (HTS) tapes from two manufacturers were prepared, and their I-V characteristics were studied at 77 K, liquid nitrogen temperature. Both types of joints were prepared by taking each sample of HTS tapes with effective overlapping lengths ranging from 30 mm to 100 mm using two low melting point soldered materials such as Pb63Sn37 and In52Sn48 alloys. Also, the pressure applied to the solder joint during the soldering process varied from 1 to 5 MPa. The effect of the type of solder materials, overlapping length, and applied pressure on the joint resistance and the critical current of the joint normalized to the critical current of initial HTS tape under a self-magnetic field were investigated at 77 K.

Author

Sumit Chand (Research Scholar)

Co-authors

Dr Abhay Singh Gour (Cryogenic Engineering Centre) Mr Abhishek Kumar (Cryogenic Engineering Centre, Indian Institute of Technology, Kharagpur) Dr Tripti Sekhar Datta (Cryogenic Engineering Centre)

Presentation materials

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