Speaker
Description
Within the CERN EP R&D programme and the DRD3 collaboration, innovative and scalable hybridisation and module-integration concepts are pursued for pixel-detector applications in future colliders. Most interconnect processes require specific surface properties and topologies of the bonding pads. An in-house Electroless Nickel Gold (ENIG) plating process is therefore under development, which is performed on single-die level and can be adapted to a large range of pad geometries and bonding techniques. The hybridisation processes under study include bonding with anisotropic conductive adhesives (ACA), as well as gold-stud bonding with epoxy underfill. This contribution introduces the developed plating and hybridisation processes, and presents recent results for dedicated test structures and functional ASICs and sensors.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |
