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2nd DRD3 week on Solid State Detectors R&D

2–6 Dec 2024
CERN
Europe/Zurich timezone

Session

WG7 - Interconnect

3 Dec 2024, 09:00
500/1-001 - Main Auditorium (CERN)

500/1-001 - Main Auditorium

CERN

400
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Conveners

WG7 - Interconnect: WG7 - Interconnect technologies

  • Dominik Dannheim (CERN)
  • Giovanni Calderini (LPNHE-Paris, Centre National de la Recherche Scientifique (FR))
  • Giovanni Calderini (Centre National de la Recherche Scientifique (FR))
  • Fabian Huegging (University of Bonn (DE))

Presentation materials

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  1. 5. SMALLGAD: Capacitively-coupled AC-LGAD pixel detector for particle detection
    Mathieu Benoit (Oak Ridge National Laboratory (ORNL))
    03/12/2024, 09:00
    WG7 - Interconnect

    In this R&D proposal, we aim at demonstrating a novel kind of low-cost, large-area, small-pixel silicon pixel detector based on AC-couple low-gain avalanche diode (AC-LGAD) technology. This new technology, the SMall pixel Adhesively coupled Large area LGAD (SMALLGAD), would combine the excellent timing resolution known of LGAD detectors with the small pixel readout of current state-of-the-art...

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  2. 60. Development of in-house plating and hybridisation technologies for pixel detectors
    Dr Ahmet Lale
    03/12/2024, 09:20
    WG7 - Interconnect

    Within the CERN EP R&D programme and the DRD3 collaboration, innovative and scalable hybridisation and module-integration concepts are pursued for pixel-detector applications in future colliders. Most interconnect processes require specific surface properties and topologies of the bonding pads. An in-house Electroless Nickel Gold (ENIG) plating process is therefore under development, which is...

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  3. 57. Development of a Novel Low-Mass Flip-Chip-Capable Module Flex PCB
    Julian Weick (CERN)
    03/12/2024, 09:40
    WG7 - Interconnect

    To reduce the material budget and maximize the active area of sensors for future experiments, a 30 µm thick lightweight flex has been developed. The fabrication technology, combined with novel interconnection techniques, enables compact packaging through the direct attachment of chip connection pads to the flex. In addition to interconnection methods such as Anisotropic Conductive Films and...

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  4. 4. DRD7.6b - Status and Plans
    Hoang Vu Nguyen (U)
    03/12/2024, 10:00
    WG7 - Interconnect

    We will present the Workpackage DRD7.6b - common access to 3D and advanced integration. Besides the installation and qualification of advanced integration technologies, one of the key being objectives is the establishment of a distributed laboratory to provide the service to the detector community.

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  5. 85. Flip-chip bonding results
    Mateus Vicente Barreto Pinto (Universite de Geneve (CH))
    03/12/2024, 10:20
  6. 68. WG7 - Discussion on Interconnect Technologies
    Dominik Dannheim (CERN), Fabian Huegging, Fabian Huegging (University of Bonn (DE)), Giovanni Calderini (Centre National de la Recherche Scientifique (FR)), Giovanni Calderini (LPNHE-Paris, Centre National de la Recherche Scientifique (FR))
    03/12/2024, 10:30
  7. 64. Development of ultra-thin hybrid pixel detectors using Wafer-to-Wafer bonding
    Fabian Huegging (University of Bonn (DE))
    WG7 - Interconnect

    Wafer to wafer bonding offers an economic approach to interconnect all readout electronic chips with the solid-state sensor chips on the wafer by only one bonding step. This is a promising technology for the fabrication of 3D integrated ultra-thin hybrid modules for particle detection and timing layers in future particle detectors. The technology described in this contribution combines the...

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