Speaker
Description
Driven by advances in manufacturing technologies, microelectronics has evolved significantly over the past decade. Beyond the traditional Moore's Law, microelectronics is becoming increasingly heterogeneous, incorporating concepts developed in part in a “More than Moore” dimension. Above all, it is increasingly understood on a system rather than a chip scale. This evolution emphasizes heterogeneous integration and innovative packaging schemes, with a strong focus on the performance of interconnections between functions.
In particular, 3D integration has emerged as a decisive approach, combining the advantages and possibilities offered by miniaturization with new flexibility in circuit design, especially in fields such as image & radiation sensors, high-performance computing and artificial intelligence. Other advanced packaging approaches are also available, such as fan-out-wafer level packaging, which is also very much in vogue at the moment. All these innovations are aimed at producing more efficiently designed systems, and are supported by major R&D efforts in both design and manufacturing technologies.
