Speaker
Description
Within the CERN EP R&D programme and the AIDAinnova and DRD3 collaborations, innovative and scalable hybridisation and module-integration concepts are pursued for pixel-detector applications in future colliders. Most interconnect processes require specific surface properties and topologies of the bonding pads. An in-house Electroless Nickel Gold (ENIG) plating process is therefore under development, which is performed on single-die level and can be adapted to a large range of pad geometries and bonding techniques. The hybridisation processes under study include bonding with anisotropic conductive adhesives (ACA), as well as gold-stud bonding with epoxy underfill. The ACA interconnect technology involves conductive micro-particles embedded in an adhesive layer applied as either film or paste. The electro-mechanical connection between the sensor and ASIC is achieved via thermo-compression of the ACA using a flip-chip device bonder. This contribution introduces the developed plating and interconnect processes, and presents recent results for dedicated daisy-chain test structures designed and produced by FBK as well as functional ASICs and sensors.
