Speaker
Description
The ATLAS inner detector will be completely replaced with a new all-silicon tracking detector (ITk) in 2026-28 to cope with the challenging conditions of the High Luminosity LHC.
The pixel detector will be located in the innermost part of the ITk detector. It will be instrumented with 3D sensor technology in the innermost layer (L0), where a fluence up to 2 x 1016 neq/cm2 is expected, and with n-in-p planar hybrid modules 150 μm and 100 μm thick in the three outer layers (L2-L4) and in the first layer (L1), respectively.
Before starting production of final modules, following the ITk Pixel QC programme, pre-production quad modules were assembled with ITkPixv1.1 chips and 150 μm thick planar sensors at the University of Glasgow as a part of the United Kingdom contribution to the production. These modules went through a series of characterization processes to evaluate electrical performance before and after parylene coating at both +200 C and -150 C temperatures. Mechanical durability of the bump bondings is also tested by thermally cycling between high (+450 C) and low (-450 C and -550 C) temperatures, and stability of the module is tested by running the module for 48 hours. All the processes are run under constant monitoring of temperature, humidity, low voltage and high voltage; an interlock system also operates to ensure safety of the module. This study will focus on the performance of the modules at different stages of characterization.
