Speaker
Description
The Katherine readout for Timepix3 [6] is among the most widely used acquisition systems for Timepix3 detectors. This device, which utilizes a Gigabit Ethernet interface, has been employed in numerous experiments by various scientific teams. However, as user requirements have evolved, it has become clear that Katherine cannot meet these increasing demands without limitations or additional modifications. To address this challenge, the Katherine readout for Timepix3 Generation 2 has been developed.
The primary focus of the new design is on multi-layer/detector support, coupled with compatibility with a broader range of chipboards. The updated device supports one or two standard CERN chipboards, as well as compatible chipboards designed by UWB/CTU. Additionally, through a specialized fanout board, users can connect up to four chipboards. A significant advancement is the native support for the Timepix3 Quad (3x3 grid) chipboard. In all configurations, uniform timing across all detectors is maintained, enabling the system’s application in diverse coincidence and time-of-flight measurement setups.
Connectivity options have also been upgraded. In addition to the existing Gigabit Ethernet interface, the device now incorporates a USB 3.0 interface. This feature allows the system to achieve the full data rate of Timepix3 — 40 MHits/s — a substantial improvement over the 14 MHits/s limit of Gigabit Ethernet. Users can choose between the two interfaces, each offering distinct advantages: Ethernet for straightforward remote control and USB for high data rates.
Another significant enhancement concerns the bias voltage supply for the sensors. Thick silicon sensors, CdTe, CZT, or GaAs sensors require higher bias voltages. To accommodate these needs, the device includes two independent high-voltage power supplies, with a voltage range from −1kV to +1kV, along with leakage current measurement capabilities.
In this contribution, the authors will present the key parameters of the newly introduced device. They will also provide examples of its application and discuss its potential use in extremely harsh radiation environments.
References:
[1] Poikela, T., et al. Timepix3: a 65K channel hybrid pixel readout chip with simultaneous ToA/ToT and sparse readout. Journal of instrumentation, 2014, 9.05: C05013.B.
[2] Bergmann, B., et al. 3D track reconstruction capability of a silicon hybrid active pixel detector. The European Physical Journal C, 2017, 77.6: 1-9.
[3] Bergmann, B., et al. 3D reconstruction of particle tracks in a 2 mm thick CdTe hybrid pixel detector. The European Physical Journal C, 2019, 79.2: 1-12.
[4] Burian, P., et al. Timepix3 detector network at ATLAS experiment. Journal of Instrumentation, 2018, 13.11: C11024.
[5] Bergmann, B., et al. Relative luminosity measurement with Timepix3 in ATLAS. Journal of Instrumentation, 2020, 15.01: C01039.
[6] P. Burian et al 2017 JINST 12 C11001
