Speaker
Description
The ATLAS inner detector will be completely replaced with a new all-silicon tracking detector
(ITk) in 2026-28 to cope with the challenging conditions of the High Luminosity LHC.
The pixel detector will be located in the innermost part of the ITk detector. It will be
instrumented with 3D sensor technology it the innermost layer (L0), where a fluence up to 2
x 1016 neq/cm2 is expected, and with n-in-p planar hybrid modules 150 μm and 100 μm thick
in the three outer layers (L2-L4) and in the first layer (L1), respectively.
The study of sensors and modules with beam is an important test bench to assess their
performance and operation, both before and after irradiation to the expected fluence. In the
last few years diVerent types of sensors produced by diVerent vendors became gradually
available to be studied with beam. In the latest 2024 test beam season new sensor types, or
produced with improved techniques, and modules equipped with the latest version of the
readout chip also became available. First thick planar sensors produced by Micron are being
tested both before and after irradiation during several test beam campaigns carried out in
2024. Eventually, the final version of the readout chip (ITkPixV2) was submitted in March
2023 and first modules assembled with the ITkPixV2 chip became available to be tested with
beam this summer. Hence, this year test beam data includes several novelties to progress
with the complete picture of the qualification of ITk pixel sensors. Some of the new 2024 test
beam data are being analyzed and some are going to be collected soon. This talk will provide
an overview of the ITk pixel sensors and modules qualification with test beams up to date
with the latest 2024 results.
