Speaker
Description
SINTEF MiNaLab is currently producing part of the 3D pixel sensors for the ATLAS ITk upgrade. Given the number of sensors requested and the complexity of the technology, the production has been split into two 24-wafer batches (Run-7 and Run-8). The two batches have been carefully scheduled to avoid conflicts in the clean room. Both batches use the common sensor layout for RD53B sensors in 50x50 (1E) configuration with slim-edge termination. Sensors are fabricated on 6-inch, Si-Si bonded wafers, with a device layer thickness of 150µm, using a single-sided processing approach. To mitigate concerns about curvature at sensor level after back-end processing, a new passivation layer has been implanted to balance the mechanical stress after support wafer removal and ease the bump-bonding process. Run-7 will be the first batch to reach the temporary metal step and the electrical characterization will start in early January 2025. In this presentation, we will focus on the measurement results from standard planar test structures, 3D diodes and 3D pixel detectors obtained from Run-7 wafers. The status of Run-8 and expected delivery schedule of the full production will also be discussed.
