Speaker
Description
Unlike the planar detector, the distance of electrodes and the thickness of substrate is decoupling in 3D silicon detector. According to the shapes of electrodes, 3D sensors can be divided into two types: the columnar electrodes and the trenched electrodes. Through shortening the distance between the electrodes, the sensor can provide higher position resolution and can also be more irradiation tolerant due to the decreased trapping probability of carriers. However, the electrode itself can form the inactive area when the particle vertically passes through the top of the sensor. Nowadays, the electrodes with 5 μm or less in diameter have been fabricated. Typically, in order to withstand the fluence of 1 × 10$^{16}$ n$\mathrm{_{eq}}$/cm$^2$, the ATLAS Inner Tracker (ITk) will use 3D sensors with 5 μm diameter columnar electrodes and small pixel cells (50×50 μm$^2$ and 25×100 μm$^2$) which are fabricated by the FBK (Itlay), CNM (Spain) and SINTEF (Norway). In addition, the time resolution of 3D sensors has been investigated which shows great potential to realize the 4D tracking. Recently, the USTC group is concentrated on the development of very small pitch, ultra thin 3D sensors whose active thickness is 50 μm and pixel cells is 50×50 μm$^2$ and 25×25 μm$^2$. This talk will present the design, fabrication and characterization of the first batch 3D sensors at USTC.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |