Speaker
Description
Sensors with fast timing capabilities are a critical component for all future tracking detectors to disentangle high multiplicity events. Double-sided silicon 3D sensors utilize columns etched orthogonal to the sensor substrate as their readout electrodes, in contrast to regular, planar detector technologies, where the electrodes are only found on the sensor surface. 3D sensors display, in addition to their excellent time resolution, a high radiation tolerance, making them ideal candidates for use in HEP tracking detectors.
In the course of a common RD50 project, double-sided 3D sensors with two different column layouts, hexagonal and rectangular, and different column counts were designed and produced by CNM.
In this presentation, updated IV and CV characteristics of these 3D sensors, as well as recent fast timing and top TCT measurement results of a small number of samples, will be presented.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |
