10–14 Nov 2025
CERN
Europe/Zurich timezone

Results from iLGAD sensors bump bonded to Timepix4

11 Nov 2025, 11:59
16m
6/2-024 - BE Auditorium Meyrin (CERN)

6/2-024 - BE Auditorium Meyrin

CERN

114
Show room on map
WG2 - Hybrid silicon sensors WG2 - Hybrid silicon technologies

Speaker

Daan Jasper Oppenhuis (Nikhef National institute for subatomic physics (NL))

Description

This presentation will show results of an inverse Low-Gain Avalanche Detector (iLGAD) with a pitch of 55 μm, a thickness of 250 μm and a large-area (2 cm2), bump bonded to a Timepix4 ASIC. The Timepix4 ASIC is the latest hybrid pixel detector of the Medipix collaboration. It consists of 448 by 512 pixels with a pixel pitch of 55 µm. The best obtained time resolution for a 100 µm planar n-on-p type sensor on Timepix4 with test beam is O (150 ps).
A new sensor design with a small pitch and a good fill factor is the inverse Low Gain Avalanche detector (iLGAD). By placing the gain layer on the opposite side of the pixel electrodes iLGADs have a uniform gain layer over the whole sensor area. This presentation shows the timing performance of a 250 µm iLGAD produced by Micron, which is bump bonded to a Timepix4 ASIC.
The iLGAD shows an almost uniform gain of around 4 and an efficiency of 99.6±0.1%. Before corrections the obtained time resolution is about 750 ps. After timewalk and clock corrections the time resolution becomes 358 ps. To understand the details of the modest time resolution also grazing angle and TPA laser measurements have been done, which allow to measure the time resolution as function of depth of the charge deposition in the sensor. This provides more insight in the time resolution, also for the perpendicular case.

Type of presentation (in-person/online) in-person presentation
Type of presentation (I. scientific results or II. project proposal) I. Presentation on scientific results

Author

Daan Jasper Oppenhuis (Nikhef National institute for subatomic physics (NL))

Presentation materials