Speaker
Description
As part of the CERN EP R&D programme and the DRD3 collaboration, innovative and scalable concepts for hybridisation and module integration are being developed for pixel detector applications in future colliders. Most interconnect processes require specific surface properties and topologies of the bonding pads. An in-house Electroless Nickel Gold (ENIG) plating process is therefore under development that can be performed at the single-die level and adapted to a wide range of pad geometries and bonding techniques. This presentation shows the results of a detailed parameter study of nickel deposition in the ENIG process. For this purpose, the height and uniformity of the nickel bumps in representative areas of the pixel matrix were measured and compared for different ENIG processing parameters.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |
