Speaker
Description
Increasing power density in modern detector front-end electronics and readout ASICs require advanced thermal management techniques that can handle heat dissipation more effectively. This challenge is particularly critical in high-energy physics experiments where spatial constraints and reliability requirements demand efficient thermal interfaces. This study presents a comprehensive comparative analysis of heat dissipation characteristics in nanowire-enhanced interconnection techniques compared to conventional bonding materials used in the detector community.
Five material systems are investigated: conductive epoxy, Araldite, thermal paste, sintered copper nanowires, and a nanowire-Araldite hybrid composite. This selection represents the spectrum from purely mechanical adhesives to advanced nanomaterial-based thermal interfaces, enabling direct comparison between established detector assembly techniques and emerging bonding technologies. Thermal conductivity and bonding strength are measured for each material system under conditions representative of detector-module operation.
The experimental setup utilises silicon wafer samples (300 μm thickness) with aluminium metallisation tracks of 5 μm thickness serving as controlled heating elements, bonded to oxygen-free copper heat sinks using each interconnection material. Thermal conductance measurements are performed using calibrated Pt1000 resistance temperature detectors (RTDs) positioned on the front surface of the wafer and in the heat sink in close proximity to the bonding region. This configuration enables direct measurement of temperature gradients across the critical thermal path from chip to cooling system. Heat loads up to 10 W/cm² simulate typical power dissipation levels in readout electronics.
Mechanical characterisation includes bonding strength measurements using a pull test machine to compare the adhesive performance across material systems.
This work aims to establish whether nanowire-enhanced interconnection techniques offer measurable thermal and mechanical advantages over conventional materials for particle physics detector applications.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |
