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LHC BGI Vacuum requirements

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30/2-040 (CERN)

30/2-040

CERN

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Cesar Vazquez Pelaez (CERN), Giuseppe Bregliozzi (CERN), Gunn Khatri (CERN), James Storey (CERN), Mark Mclean (CERN)
2025-10-06 Vacuum considerations.pdf
2025-10-06 Vacuum considerations.pptx
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Draft:

Present:

Giuceppe, Mark, James, Gunn, Cesar

Discussion:

  • Mark presents slides, starting with BGI introduction
  • Outstanding issue is how to mechanically atatch the chip to the base such that it conducts heat generated from chip operation
  • Staystick 672 is not an option (bakeout @120 degree C), see EDMS 2618330 (2021 by Swann) & EDMS 1879485 (2018 by Nicola)
  • Staystick 101, too hot for sensor, not good
  • Masterbond SUP121AO, possible option
  • Brazing and mechanical options also discussed but less preferres due to difficulties and reducing effective detection area.
  • Silicon vias (solder bond balls), possibly work but low theraml conduction surface
  • Allectra Glue4, identified as a good option -> good theraml conductivity and curing temperature ok, bakeable
  • Cesar and Giuseppe agreed to do some sample tests for the Allectra Glue4. in vacuum, bakeout/curing/outgessing
  • SY-BI will order the Allecra Glue4 and provide it to TE-VSC for the tests

 

Other references:

1. Ceramic microchannels (LTCC): https://indico.cern.ch/event/1535828/contributions/6486309/attachments/3085211/5462044/250612_Ceramics.pdf

There are minutes attached to this event. Show them.
    • 15:00 → 16:00
      Theramal/mechanical atatchment of timepix chip

      Mark gave presentation

      Convener: Mark Mclean (CERN)