29 February 2012 to 2 March 2012
Jozef Stefan Institute
Europe/Zurich timezone

Development of novel KEK/HPK n(+)-in-p silicon sensors and evaluation of performance after irradiation

29 Feb 2012, 15:20
25m
Main Lecture Hall (Jozef Stefan Institute)

Main Lecture Hall

Jozef Stefan Institute

Jamova 39, Ljubljana, Slovenia

Speaker

Yoshinobu Unno (High Energy Accelerator Research Organization (JP))

Description

We have been developing highly radiation-tolerant n(+)-in-p silicon planar pixel and microsrip sensors for use in the high-luminosity LHC. Novel n(+)-in-p pixel sensors were made using a combinations of the bias structure of punch-through or polysilicon resistor, the isolation structure of p-stop or p-spray, and the thickness of 320 $\mu$m or 150 $\mu$m. The strip sensors and associated test structures were made of the polysilicon resistor and the p-stop isolation structures. The strip sensors and test structures were irradiated using 70 MeV protons to particle fluences of 5x10^12 to 1x10^15 , and the pixel sensors using 23 MeV protons to 2x10^15 1-MeV neq/cm^2. In evaluating the performance of the irradiated sensors, we have observed a number of effect that we would like to understand: (1) decreased efficiency under the bias rail, (2) increased onset voltage in the punch-through protection structures, (3) decreased potential of the p-stop implant between the n(+) strips,(4) decreased active area in the strip end, etc. We discuss the common source that may have caused the above observations.

Author

Yoshinobu Unno (High Energy Accelerator Research Organization (JP))

Presentation materials